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Advanced Packaging Designs:

3D Packaging for Better System Performance&Form Factor

Allics provides package design in-house, assembly and test in collaboration with our OSAT partners, including 2.5D,3D,HD_FO and Photonics advanced package technologies. Test development and capabilities include RF, analog, embedded memory, photonics and mmWave applications, with wide array of tester platforms for wafer sort operations at foundry. Different package technologies achieve the right balance Power, performance, cost & form-factor optimized solutions in 3DIC (FCBGA, FCMCM, WLCSP, CoWoS, InFo-PoP, CoC, PoP, Stacked-die, WoW, TSV. TGV & TOV).

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