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Advanced Packages Design Services:

Extending IC Design Services into the Co-Designing Chips, Packages and PCBs with Advanced 3DIC Multi-Die Packaging.

 

Allics provides package design in-house, assembly and test in collaboration with our OSAT partners, including 2.5D,3D,HD_FO and Photonics advanced package technologies. Test development and capabilities include RF, analog, embedded memory, photonics and mmWave applications, with wide array of tester platforms for wafer sort operations at foundry. Different package technologies achieve the right balance Power, performance, cost & form-factor optimized solutions in 3DIC (FCBGA, FCMCM, WLCSP, CoWoS, InFo-PoP, CoC, PoP, Stacked-die, WoW, TSV. TGV & TOV).

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